Our PCD(Polycrystalline Diamond) die blanks is produced by unique ultra high-pressure sintering technology, consisting of randomly orientated micron size diamond crystals, with extremely high diamond-to-diamond bonding offering both strong and wear resistant wire drawing material.
a). Compared to natural diamond, our PCD die blanks have no cleavage planes, which makes them highly resistant to breakage.
b).Excellent wear resistance
c).High quality polished surface
Two series of PCD die blanks for wire drawing are produced by us, HNI-SD series and HNI-CD series with round shape and hexagonal shape.
Available grain size 5 micron,10 um,25um,50um with dimensional sizing designation from D6 to D36.
HNI-CD series divides into self-supported die blanks and tungsten carbide supported die blanks. It contains metal catalyst and its thermally stable ability is up to 650℃, and they are to be mounted at temperatures not exceeding 650℃. HNI-CD die blanks are electrically conductive and can be drilled and shaped by EDM, laser and ultrasonic etc.
HNI-CD can be used for stainless steel, copper, aluminum, nickel and alloys etc.
HNI-SD series has self-supported die blanks. It is a kind of ceramic-bonded diamond which thermal stability is to 1200℃ and can be mounted at high temperature. HNI-SD series can be drilled and shaped by ultrasonic and laser etc, it is not recommended by EDM because it is not electrically conductive.
HNI-SD be recommended to be used for Tungsten, Molybdenum etc.
HNI-CD SELF-SUPPORTED DIE BLANKS
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产品编号
Product
Number
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ADDMA
代码
Designation
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金刚石直径*厚度
Diamond Diameter*Thickness
(mm)
|
可供粒度
Grain Size Available（μm）
|
|
1μm
（001）
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3μm
（003）
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5μm
（005）
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10μm
（010）
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25μm
（025）
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50μm
（050）
|
|
六方形/Hexagonal
|
|
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HNI-CD210H
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D6
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2.5*1.0
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.
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.
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.
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.
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.
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HNI-CD315H
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D12
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3.2*1.5
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.
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.
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.
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.
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.
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HNI-CD525H
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D15
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5.2*2.5
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.
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.
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.
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.
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.
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HNI-CD535H
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D18
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5.2*3.5
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.
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.
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.
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.
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.
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圆形/Round
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HNI-CD310
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D6
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3.2*1.0
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.
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.
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.
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.
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.
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HNI-CD315
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D12
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3.2*1.5
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.
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.
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.
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.
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.
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HNI-CD525
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D15
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5.2*2.5
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.
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.
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.
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.
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.
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HNI-CD535
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D18
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5.2*3.5
|
.
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.
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.
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.
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.
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HNI-SD SELF-SUPPORTED DIE BLANKS
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产品编号
Product
Number
|
ADDMA
代码
Designation
|
金刚石直径*厚度
Diamond Diameter*Thickness
(mm)
|
可供粒度
Grain Size Available（μm）
|
|
1μm
(001)
|
3μm
(003)
|
5μm
(005)
|
10μm
(010)
|
25μm
(025)
|
50μm
(050)
|
|
六方形/Hexagonal
|
|
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HNI-SD210H
|
D6
|
2.5*1.0
|
.
|
.
|
.
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.
|
.
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HNI-SD315H
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D12
|
3.2*1.5
|
.
|
.
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.
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.
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.
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HNI-SD525H
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D15
|
5.2*2.5
|
.
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.
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.
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.
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.
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HNI-SD535H
|
D18
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5.2*3.5
|
.
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.
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.
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.
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.
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圆形/Round
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|
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HNI-SD310
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D6
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3.2*1.0
|
.
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.
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.
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.
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.
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HNI-SD315
|
D12
|
3.2*1.5
|
.
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.
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.
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.
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.
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HNI-SD525
|
D15
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5.2*2.5
|
.
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.
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.
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.
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.
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HNI-SD535
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D18
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5.2*3.5
|
.
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.
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.
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.
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.
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HNI-CD TUNGSTEN CARBIDE SUPPORTED DIE BLANKS
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产品编号
Product
Number
|
ADDMA
代码
Designation
|
金刚石直径*厚度
Diamond Diameter*Thickness
(mm)
|
可供粒度（μm）
Grain Size Available
|
|
3μm
(003)
|
5μm
(005)
|
10μm
(010)
|
25μm
(025)
|
50μm
(050)
|
|
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HNI-CD415
|
D12
|
4.2*1.5
|
|
.
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|
.
|
.
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HNI-CD423
|
D15
|
4.2*2.3
|
.
|
.
|
.
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.
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.
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HNI-CD429
|
D18
|
4.2*2.9
|
.
|
.
|
.
|
.
|
.
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HNI-CD638SP
|
D21
|
6.8*3.8
|
.
|
.
|
.
|
.
|
.
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HNI-CD653SP
|
D24
|
6.8*5.3
|
.
|
.
|
.
|
.
|
.
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HNI-CD1285SP
|
D27
|
12.9*8.7
|
|
|
.
|
.
|
.
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HNI-CD1285SPX
|
D27
|
12.9*8.7
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|
|
.
|
.
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.
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HNI-CD1212SP
|
D30
|
12.9*12.0
|
|
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.
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.
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.
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HNI-CD1212SPX
|
D30
|
12.9*12.0
|
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.
|
.
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.
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HNI-CD1512SP
|
D30
|
15.2*12.1
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|
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.
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.
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HNI-CD1512SPX
|
D30
|
15.2*12.1
|
|
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.
|
.
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HNI-CD1515SP
|
D33
|
15.2*15.1
|
|
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.
|
.
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HNI-CD1515SPX
|
D33
|
15.2*15.1
|
|
|
|
.
|
.
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HNI-CD1813SP
|
D30
|
18.2*13.5
|
|
|
|
.
|
.
|
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HNI-CD1815SP
|
D33
|
18.2*15.5
|
|
|
|
.
|
.
|
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HNI-CD1817SP
|
D33
|
18.2*17.5
|
|
|
|
.
|
.
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Mount at temperatures not exceeding 650℃
Maximum recommended bearing diameter for “soft” nonferrous wire. “Hard”wire diameter normally should not exceed 65% off this diameter.
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